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AMD and Schneider Electric launch reference standards for Helios AI rack

AMD and Schneider Electric have developed a joint blueprint for deploying the chip company’s Helios rack architecture in AI data centers.. The reference design was unveiled today at AMD’s Advancing AI 2026 event, taking place in San Francisco.. It “provides a scalable blueprint for deploying high-density AI environments faster and with reduced risk and complexity,” the companies said..

The AMD Helios rack – AMD. Unveiled at the Advancing AI conference in 2025, Helios is a unified architecture designed for both frontier AI model training and large-scale inference, delivering “leadership” across compute density, memory bandwidth, and scale-out interconnect..

A double-wide rack, Helios is fully integrated with AMD’s Zen 6 Eypc CPUs, MI400 GPUs, and Vulcano NICs.. The new reference designs show how Helios can be integrated with the rest of a data center’s systems. They contain information on four technical areas: facility power, facility cooling, IT space, and lifecycle software..

“Today organizations require comprehensive, AI-ready reference designs that can take them from planning to deployment faster and with less risk,” said Manish Kumar, EVP for secure power and data centers at Schneider Electric.. “Through our collaboration with AMD, we’re delivering an engineering-backed reference design that bridges the gap between advanced AI compute platforms, energy tech, and real-world data center implementation, enabling customers to deploy scalable, high-density AI environments with greater confidence, efficiency, and speed.”.

The designs cater for AI clusters of up to 10.4MW at new build sites, and individual rack densities of up to 246kW. They support advanced liquid cooling from Schneider Electric’s Motivair division, which offers CDU-based and hybrid air/liquid approaches.. Forrest Norrod, EVP and GM in the data center solutions business group at AMD, added: “AI infrastructure is rapidly moving to full-scale AI factories, and that requires compute, networking, power and cooling to be designed together from the start..

“AMD Helios provides an open, rack-scale architecture built to deliver the performance, efficiency and flexibility required for next-generation AI workloads. By working with Schneider Electric to create a validated reference design, we are giving customers a practical blueprint to accelerate high-density AI deployments, reduce integration risk and scale with greater confidence and efficiency.”.

More in Cooling. 23 Jul 2026. More in Rack Level.

19 Feb 2026. 01 May 2026

 

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