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Sponsored: Why densification is forcing a cooling rethink

Everyone aims to enhance their data center power production. The urge to consolidate, spurred by AI integration, GPU clusters, cloud expansion, and HPC, has reached unprecedented levels. Operators aim to increase computing power and revenue without expanding physical space, leading to an increase in thermal intensity.

With more heat produced in the same area, traditional cooling systems are reaching their limits. To accommodate higher rack power densities, operators must adapt their cooling methods, resulting in the emergence of a new high-density air-cooled infrastructure to tackle escalating thermal challenges.

In conclusion, according to Patrick Cotton, the product management director at Airedale by Modine, the following statement can be made: As per Patrick Cotton of Airedale by Modine, cooling is an indispensable part of any data center, and there is a substantial demand for providing high-density solutions at a large scale; it’s absolutely necessary for smooth operation. “Cooling is an essential aspect of any data center, and there is substantial demand for providing high-density solutions at a large scale – it’s absolutely necessary for operations.” Pressure on conventional cooling systems. As the need for cooling increases, operators must deal with an unwanted situation.

Increasing heat removal from the data hall results in more heat being rejected outside, creating thermal management issues on both sides of the system. This impact is felt throughout the entire thermal chain – higher cooling demands lead to increased water flow rates, which in turn require larger pipes and stronger supporting infrastructure.

This can lead to increased space and power limitations, resulting in a cycle where the infrastructure needed to support high-density IT loads increasingly competes with the IT equipment for limited capacity. For instance, at the heat rejection stage, a dry cooler may need to be significantly larger to provide the same cooling capacity under high thermal loads.

 

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