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Anthropic publicly confirms it is putting together an in-house chip design team

Anthropic is building an in-house chip design team that will oversee the development of custom AI hardware.. First reported by Business Insider, the AI company has publicly confirmed reports that first emerged in April 2026 that claimed it was exploring the possibility of designing its own AI chips.. – Anthropic.

According to BI, an Anthropic spokesperson said the company is putting together an in-house chip team that will focus on co-designing custom hardware that will allow its Claude large language model (LLM) to run faster and more efficiently.. Job listings posted by Anthropic include silicon engineer and hardware system architect roles..

Currently, Anthropic uses a large number of chips, including Nvidia and AMD GPUs, Google TPUs, and Amazon Trainium hardware. In response to a request for comment from DCD, a spokesperson from Anthropic confirmed that the company was building an in-house silicon team to design custom chips for Claude, but said the move was “the latest step in our multi-chip approach,” and that the company would continue deploying a “diversified hardware stack.”.

In June 2026, DCD was the first to report that OpenAI’s custom chip program lead Clive Chan had quit to join Anthropic. At the time, Chan wrote on X: “I joined Anthropic this week because I was deeply impressed with the team’s talent, values, and ambition, and I’m already energized by the pace and intensity of the past few days.

It’s time to build.”. The spokesperson for Anthropic told DCD it does not have any comment to add on the in-house chip team’s structure.. The same month Chan announced his departure, OpenAI and Broadcom debuted ‘Jalapeño,’ their first co-designed Intelligence Processor for LLM inference..

The chip went from initial design to manufacturing tape-out in just nine months, the companies said, which they claimed was likely the fastest ASIC development cycle ever achieved in high-performance advanced semiconductors. First shipments are expected by the end of 2026.. More in IT Hardware & Semiconductors.

23 Jul 2026. More in North America. 10 Jun 2026.

23 Apr 2026

 

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