Trending
Microsoft acquires 37 acres in Licking County, Ohio Ukraine’s Atesh attacks comms tower in Russia’s Belgorod region AWS capacity “largely” sold out in 2027, Amazon CEO claims Ecoblox partners with Rimac on modular data center solution ZutaCore details new two-phase boiling technology for liquid-cooled data centers G42 signs MoU for AI infrastructure in Greece Fewer Care Delays, More Cost Savings: Nationwide Diagnostic Image Exchange Is Possible With TEFCA Google ordered to suspend site work at two data centers in Finland following tree clearing controversy Data Centers Bring Boom Times, But Will Gains Last? Thieves repeatedly steal copper and tools from Culpeper data center construction site DCD Studio: The future of data centers with Jim Simonelli, Schneider Electric Sponsored: The next evolution of data center backup power Microsoft introduces new sovereignty tools across public and private cloud Cadence unveils Nvidia-powered AI data center in Munich, Germany Quandela and Quanova partner for deployment of first quantum computer in Vietnam

TSMC and Samsung commit to adopting ASML’s High NA EUV lithography tools by 2030

TSMC and Samsung have committed to using ASML’s High NA extreme ultraviolet (EUV) lithography technology.. Samsung said it plans to begin adoption of the technology by 2028 for production of its memory chips, while TSMC will start using the tools from 2030.. – Intel. In July, ASML announced that Intel has already started using its High NA EUV technology to manufacture its Intel Core Ultra Series 3 processors, code-named Panther Lake, built on Intel 18A process node technology..

The news comes five months after TSMC released an updated 2029 product roadmap, with the chipmaker stating at the time that all the technologies included on it would be manufactured using extreme-ultraviolet lithography (EUV) tools from ASML, instead of the most advanced high-NA EUV machines.. ASML also announced it would be working with Intel, Samsung, and TSMC on an industry initiative that aims to support the transition from six-inch to 12-inch photomasks (the templates for a chip’s design)..

In a statement, ASML CEO Christophe Fouquet said the move to 12-inch masks will enable “greater scanner productivity and allow the industry to meet the demand for smaller, faster and more energy-efficient chips.”. “We are pleased by the strong initial support of semiconductor manufacturers, mask suppliers and partners for this initiative,” he added..

Netherlands-based ASML is the sole global supplier of EUV photolithography machines that are needed to make the most advanced 3nm and 5nm chips.. High NA EUV machines – the most advanced lithography tools available – require less light per exposure than traditional EUV machines, reducing the time required to print each layer and therefore increasing wafer output.

However, they also cost around double the amount of the standard EUV machines, with each unit costing approximately $370 million.. Following the publication of the Dutch company’s Q2 2026 results, Fouquet said that in 2027, ASML was “pretty much already close” to receiving all the EUV orders it needs, “this is with us adding about 30 percent capacity for EUV in 2027 versus 2026.”.

For 2028, he said that the company had begun exploring an additional 30 percent capacity increase, due, in part, to the “large number of orders from our customers for EUV” that it has already received.. More in IT Hardware & Semiconductors. 02 Jun 2026.

10 Apr 2026. More in IT Hardware & Semiconductors. 02 Apr 2026

 

Join the conversation

Your email address will not be published. Required fields are marked *