ZutaCore has introduced a novel Two-Phase Matrix Flow Boiling technology within its OmniTherm series of cold plates designed for liquid-cooled IT equipment. This innovation consists of two stages and is part of the company’s latest offerings. The company claims that their technology, built on a manifold supplying a matrix of boiling regions, can maintain a stable, uniform temperature for the hottest AI chips and the hot spots moving within them, using a cold plate slim enough to fit in a single-wide PCIe slot.
ZutaCore states that Two-Phase Matrix Flow Boiling combines the stability of pool boiling with the scalability of flow-boiling. Many small boiling regions are simultaneously fed with fluid from common headers, as vapor escapes directly upwards from each one. “AI cooling has become a complex system-wide issue: it is essential to cool the silicon while maintaining the stability of entire racks and rows,” stated My D.
Truong, the chief product and technology officer at ZutaCore. “Matrix Flow Boiling merges the stability of pool boiling with the scalability of flow boiling, ensuring that cooling occurs precisely where heat is generated. Omnitherm offers the ability to cool today’s GPUs, expands to the multi-kilowatt chips planned for the future, and provides a scalable method to access the package and reach the silicon directly.
Omnitern hybrid copper-aluminum coldplates can be slim up to 11.6 mm and light as 300g. This quarter, Nvidia RTX PRO 6000 Blackwell Server Edition deployments are being carried out, according to the company. ZutaCore employs closed-loop two-phase cooling, a form of liquid cooling that involves the coolant boiling and condensing (changing its phase), thus removing heat more efficiently than conventional heat conduction.
Wiwynn, a Taiwanese IT infrastructure provider, and Carrier, an HVAC firm, are both investors in the company. Mitsubishi Electric, Carrier Ventures, and Samsung Electronics made investments in the company during the first half of this year.
