Qualcomm is teaming up with Amazon to develop customized AI infrastructure solutions.. In what is described as a multi-generational partnership, Qualcomm Technologies and Amazon will develop customized silicon for large-scale AI data centers, specifically targeting AI inference, as well as optical connectivity solutions extending up to 1.6T.. – Getty Images.
The partnership will combine Amazon’s AI infrastructure with Qualcomm’s chip design experience. Meanwhile, work on new optical connectivity solutions will use Qualcomm Technologies SerDes and optical DSP technologies.. Qualcomm will also increase its own use of AWS’ AI infrastructure, including the Amazon Bedrock platform for its electronic design automation workloads..
“As AI demand accelerates, data center infrastructure will require advances in both computing and connectivity to deliver greater performance with more efficiency,” said Cristiano Amon, president and CEO, Qualcomm Incorporated. “Qualcomm is pleased to work with AWS on customized silicon and connectivity solutions, bringing decades of leadership in advanced processing and power-efficient compute, to deliver breakthrough performance and enable the next generation of AI infrastructure.”.
“This collaboration with Qualcomm Technologies builds on a strong foundation of partnership and reflects our shared commitment to pushing the boundaries of what’s possible,” added Prasad Kalyanaraman, vice president, AWS. “By working together on customized silicon and advanced connectivity, we’re delivering more performant, efficient, and cost-effective infrastructure for our customers.”.
AWS’ custom silicon includes its Trainium and Inferentia chips, which are designed for AI workloads, and its Graviton CPU. The Trainium3 generation was made available in December 2025, and is the company’s first 3nm AI chip, and according to the company, the Trainium3 UltraServer offers up to 4.4x more compute performance, four times greater energy efficiency, and nearly four times more memory bandwidth than the previous generation..
Qualcomm unveiled a number of new data center offerings in June of this year, including the Qualcomm Dragonfly C1000 CPU, Qualcomm High Bandwidth Compute (HBC), and the Qualcomm Dragonfly AI300 inference accelerator. Meta has signed on as a customer for the Dragonfly C1000 CPU and will use the chips in its next-generation server fleet..
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